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  ? semiconductor components industries, llc, 2013 october, 2013 ? rev. 2 1 publication order number: nsr20f40/d NSR20F40NXT5G schottky barrier diode these schottky barrier diodes are optimized for low forward voltage drop and low leakage current and are offered in a chip scale package (csp) to reduce board space. the low thermal resistance enables designers to meet the challenging task of achieving higher efficiency and meeting reduced space requirements. features ? very low forward voltage drop ? 550 mv @ 2.0 a ? low reverse current ? 15  a @ 10 v vr ? 2.0 a of continuous forward current ? power dissipation of 665 mw with minimum trace ? esd rating ? human body model: class 3b esd rating ? machine model: class c ? very high switching speed ? these devices are pb ? free, halogen free/bfr free and are rohs compliant typical applications ? lcd and keypad backlighting ? camera photo flash ? buck and boost dc ? dc converters ? reverse voltage and current protection ? clamping & protection markets ? mobile handsets ? mp3 players ? digital camera and camcorders ? notebook pcs & pdas ? gps maximum ratings rating symbol value unit reverse voltage v r 40 v forward current (dc) i f 2.0 a forward surge current (60 hz @ 1 cycle) i fsm 28 a repetitive peak forward current (pulse wave = 1 sec, duty cycle = 66%) i frm 4.0 a esd rating: human body model machine model esd > 8 > 400 kv v stresses exceeding maximum ratings may damage the device. maximum ratings are stress ratings only. functional operation above the recommended operating conditions is not implied. extended exposure to stresses above the recommended operating conditions may affect device reliability. 40 v schottky barrier diode 1 cathode 2 anode http://onsemi.com device package shipping ? ordering information NSR20F40NXT5G dsn2 (pb ? free) 5000 / tape & reel ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our tape and reel packaging specifications brochure, brd8011/d. dsn2 (0603) case 152ab marking diagram pin 1 20f40 = specific device code yyy = year code 20f40 yyy 1 2
NSR20F40NXT5G http://onsemi.com 2 thermal characteristics characteristic symbol min typ max unit thermal resistance junction ? to ? ambient (note 1) total power dissipation @ t a = 25 c r  ja p d 213 586 c/w mw thermal resistance junction ? to ? ambient (note 2) total power dissipation @ t a = 25 c r  ja p d 80 1.56 c/w w storage temperature range t stg ? 40 to +125 c junction temperature t j +150 c 1. mounted onto a 4 in square fr ? 4 board 50 mm sq. 1 oz. cu 0.06? thick single sided. operating to steady state. 2. mounted onto a 4 in square fr ? 4 board 1 in sq. 1 oz. cu 0.06? thick single sided. operating to steady state. electrical characteristics (t a = 25 c unless otherwise noted) characteristic symbol min typ max unit reverse leakage (v r = 10 v) (v r = 40 v) i r 15 150  a forward voltage (i f = 1.0 a) (i f = 2.0 a) v f 0.47 0.55 v figure 1. reverse current vs. reverse voltage figure 2. forward current vs. forward voltage v r , reverse voltage (v) v f , forward voltage (v) 35 30 25 20 15 10 5 0 0.001 0.01 0.1 1 10 100 10,000 100,000 0.6 0.5 0.4 0.3 0.2 0.1 0 0.001 0.01 0.1 1 figure 3. capacitance v r , reverse voltage (v) 40 30 25 20 15 10 5 0 0 50 100 150 200 250 350 400 i r , reverse current (  a) i f , forward current (a) c, capacitance (pf) 40 1000 150 c 125 c 75 c 25 c ? 25 c 150 c 125 c 75 c 25 c ? 25 c 300 35 t a = 25 c
NSR20F40NXT5G http://onsemi.com 3 package dimensions dsn2, 1.6x0.8, 0.9p, (0603) case 152ab issue b notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: millimeters. a b e d bottom view b 0.05 b a c l2 0.05 c top view 0.05 c a a1 0.05 c 0.05 c c seating plane side view dim min max millimeters a 0.25 0.31 a1 ??? 0.05 b 0.55 0.65 d 1.60 bsc e 0.80 bsc l 1.45 1.55 mounting footprint* dimensions: millimeters 1.70 0.80 1.05 0.70 *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. 1 xxxx yyy jan xxxx y09 year code device code feb mar sep dec jun oct nov indicates aug 2009 (example) cathode band month coding see application note and8464/d for more mounting details l2 0.90 1.00 l3 0.25 0.35 l 0.05 b a c l/2 l3 0.52 pin 1 on semiconductor and are registered trademarks of semiconductor co mponents industries, llc (scillc). scillc owns the rights to a numb er of patents, trademarks, copyrights, trade secrets, and other inte llectual property. a listing of scillc?s product/patent coverage may be accessed at ww w.onsemi.com/site/pdf/patent ? marking.pdf. scillc reserves the right to make changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and s pecifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/ or specifications can and do vary in different applications and actual performance may vary over time. all operating parameters, including ?typical s? must be validated for each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the right s of others. scillc products are not designed, intended, or a uthorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in whic h the failure of the scillc product could create a situation where personal injury or death may occur. should buyer purchase or us e scillc products for any such unintended or unauthorized appli cation, buyer shall indemnify and hold scillc and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unin tended or unauthorized use, even if such claim alleges that scil lc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyrig ht laws and is not for resale in any manner. publication ordering information n. american technical support : 800 ? 282 ? 9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81 ? 3 ? 5817 ? 1050 nsr20f40/d literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 303 ? 675 ? 2175 or 800 ? 344 ? 3860 toll free usa/canada fax : 303 ? 675 ? 2176 or 800 ? 344 ? 3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your local sales representative


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